We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Epoxy adhesive.
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Epoxy adhesive Product List and Ranking from 24 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Oct 15, 2025~Nov 11, 2025
This ranking is based on the number of page views on our site.

Epoxy adhesive Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Oct 15, 2025~Nov 11, 2025
This ranking is based on the number of page views on our site.

  1. 寺田 Tokyo//Electronic Components and Semiconductors
  2. 理経 Tokyo//IT/Telecommunications
  3. レジナス化成 Tokyo//Manufacturing and processing contract
  4. 4 ダイゾー ニチモリ事業部 Tokyo//Chemical
  5. 5 MUROMACHI CHEMICALS INC. Chemicals Division Fukuoka//Chemical

Epoxy adhesive Product ranking

Last Updated: Aggregation Period:Oct 15, 2025~Nov 11, 2025
This ranking is based on the number of page views on our site.

  1. Epoxy adhesive Araldite RAPID 寺田
  2. Epoxy-based adhesive Araldite 2011 (TDS and SDS available) 寺田
  3. Epoxy adhesive Araldite AV138M-1/HV998-1 寺田
  4. 4 Epoxy adhesive Araldite 2014-2 (TDS and SDS available) 寺田
  5. 5 Adhesive Araldite AW106J CI/HV953U J CI 寺田

Epoxy adhesive Product List

1~15 item / All 85 items

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"Insulating" grade NIC BOND NB4000 Series

It is suitable for adhesion to areas requiring insulation. Non Conductive Type

NIC BOND NB4000, 6000 Series Meets the requirements for die bonding in electrical insulation applications, high reliability, workability, and thermal conductivity. High Performance, Thermal Conductive, Non-conductive Epoxy Adhesives. Direct contact information for Nichimoly If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • H62シリンジ2.jpg
  • Other semiconductors
  • Other electronic parts
  • Other machine elements

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NIC BOND "Free Sample" Service

We will provide free samples of NIC BOND products.

We will provide free samples of various adhesives with conductivity, insulation, halogen-free, heat dissipation, heat resistance, and ultra-flexibility.

  • E-Parts All 1.jpg
  • Other electronic parts
  • Other Connectors
  • Other motors

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Instructions for Super Flexible Epoxy Adhesive

Grows rapidly! Super flexible epoxy adhesive with a growth rate of over 200%!

In "The Manual for Super Flexible Epoxy Adhesive," we introduce products like the Super Flexible Epoxy Adhesive NIC BOND. It includes a Q&A section to solve your adhesive-related problems. Additionally, we feature a diverse lineup suitable for various applications. [Contents] ■ What is the Super Flexible Epoxy Adhesive NIC BOND? ■ Examples of its impressive stretchability ■ What adhesive-related issues do you have? ■ A lineup of 50 types for different applications ■ Product overview and applications, among others *For more details, please refer to the catalog or feel free to contact us.

  • glue
  • Other consumables

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Warm water peelable epoxy adhesive "NIC BOND NB10000"

Easy to peel off in 30 minutes in warm water (60-80℃)! Reduces damage to parts, materials, and equipment.

The warm water peelable epoxy adhesive "NIC BOND NB10000" is a temporary adhesive that can be easily peeled off with warm water at temperatures between 60°C and 80°C. It is an epoxy-based adhesive that cures at room temperature to low temperatures, and after curing, it has adhesive strength equivalent to that of standard epoxy resin adhesives. It is expected to be useful for temporary bonding applications during the processing of materials that are difficult to peel off after bonding, such as "silicone ingots, sapphire, glass, neodymium-based magnetic materials, and semiconductors." 【Features】 ■ Cures at room temperature ■ High strength epoxy adhesive ■ Peels off in warm water (60-80°C) in 30 minutes ■ Does not use lactic acid, alkaline acids, or other chemicals *For more details, please refer to the catalog or feel free to contact us.

  • glue
  • Other consumables

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200-degree heat-resistant adhesive! Room temperature curing two-component epoxy adhesive.

Two-component epoxy adhesive 'Alteco 3900' that maintains strength for a long time at 200℃.

Alteco 2-component (base agent and hardener) epoxy resin-based adhesive not only boasts strong adhesion but also demonstrates excellent durability under harsh conditions such as heat and chemicals. The 2-component epoxy adhesive "Alteco 3900" is a room temperature curing type that exhibits high heat resistance. Since it does not contain volatile solvents, there is almost no shrinkage during curing. Being a room temperature curing type, it does not require large equipment. 【Specifications】 Model number: 3900 (provisional) Viscosity: Base agent 31,000 mPa·s, Hardener 3,100 mPa·s *For more details, please download the PDF or contact us.

  • Other electronic parts

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One-component low-temperature curing epoxy adhesive Seal-glo LTG800

Low-temperature (80°C and above) curable thermosetting epoxy adhesive! Ideal for bonding resins with low heat resistance.

Seal-glo LTG800 is a one-component heat-curing epoxy adhesive developed to meet the needs for low-temperature and short-time thermal curing, such as fixing LED backlight lenses and bonding resins (like ABS and acrylic) with a heat resistance of below 100°C. 【Features】 - As a low-temperature curing adhesive, it maintains sufficient adhesive strength at 80°C for 3 minutes. - Being a low-temperature thermal curing adhesive, it can reduce production costs during heating. - It does not run or string when dispensed, maintaining a stable application shape. - It is suitable not only for lens fixation but also for bonding between resins, sealing, and glass adhesion. *For more details, please request materials or view the PDF data available for download.

  • glue
  • LED Module
  • LCD display

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High-precision adhesive usable for ±50μ implementation! Self-alignment adhesive.

The cream solder allows for self-alignment and does not inhibit sinking during melting, enabling high-precision mounting. It can also be used as a corner bond.

Seal-glo "NE9000H" is a one-component heat-curing epoxy adhesive developed as a high-temperature curing adhesive. 【Features】 It is a double-sided reflow adhesive that can be used in conjunction with cream solder. When applied with a dispenser, its high profile allows it to be used for securing larger components with significant gaps or as a corner bond instead of underfill. Since the adhesive cures after the self-alignment function of the cream solder has taken effect, it does not hinder the self-alignment of the solder or the sinking during solder melting. Being a red bond, it can be verified through image inspection (SPI). 【Adoption Case】 It has been adopted for the implementation of automotive LED headlights and has begun mass production. For details on characteristics and cured properties, please download the PDF or contact us.

  • Coating Agent

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Room temperature curing ultra-flexible epoxy adhesive

Room temperature curing ultra-flexible epoxy adhesive

【Features】 ● A highly unique epoxy adhesive that cures to form a flexible bonding layer. ● Two-component, room temperature curing epoxy. It has enough flexibility to be tied into a knot with a sample made in a string shape. ● Ideal for areas subjected to high loads from thermal shock, associated expansion and contraction, and vibrations.

  • glue

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Adhesive for strain gauge type transducers M-Bond43-B

One-component epoxy adhesive for converters

One-component epoxy adhesive for transducers ■□■Features■□■ Can be used as an adhesive for strain gauges or as a protective coating for gauges. Similar to M-BOND610, it forms a very thin, uniform, and strong adhesive layer. Excellent resistance to moisture and chemicals. ■Operating temperature: -269 degrees to +120 degrees ■Shelf life: 9 months (+24 degrees), 12 weeks (+5 degrees) ■Pressure: 3-4 Kg/cm² (3.4 Kg/cm² is optimal) ■For other functions and details, please download the catalog or contact us.

  • Converters and Transducers
  • glue

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Magnolia epoxy adhesive

We offer a wide range of two-component epoxy adhesives for various applications, including aircraft, general industry (electronic components, filters, construction), and more.

For inquiries about this product, please visit our website below. https://www.kbk.co.jp/en 【Features】 ○ Two-component epoxy adhesive ○ Usable temperature: -55 to 200°C ○ Cures at room temperature in 1 to 3 days. ○ Has numerous achievements in the aerospace field and is certified by various companies. - For civilian use: Boeing, Rolls Royce, Bombardier, etc. - For defense use: Lockheed, Gulfstream, Cessna, Sikorsky, etc.

  • glue

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Conductive, thermal conductive, and insulating epoxy adhesive 'EPO-TEK'

High-quality epoxy adhesive "EPO-TEK" series [conductive, insulating, thermal conductive, optical applications] offers a variety of adhesives.

High-quality epoxy adhesive "EPO-TEK" series ■ Conductive and thermally conductive epoxy adhesive ■ Insulating and thermally conductive epoxy adhesive ■ Epoxy adhesive for optics/fiber optics

  • glue

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Epoxy-based adhesive Plaseal E-130 (summer/winter)

"Moisture-resistant epoxy adhesive" is easy to apply for gap filling and wrapping because it has a clay-like consistency!

Plasheel E-130 is an epoxy adhesive that excels in high adhesion and strength/toughness, and has minimal volume shrinkage after curing. 【Features】  ■ Strong adhesion even on wet surfaces  ■ Easy to use on walls and for wrapping applications due to its paste-like consistency  ■ Almost no volume shrinkage after curing  ■ High tensile adhesion strength and high compressive strength 【Main Applications】  ■ Filling gaps around piping  ■ Fixing joint connections  ■ Repairing concrete and stone materials  ■ Repairing leaks, defects, and cracks  ■ Assisting in utility pole removal projects  ■ Model making * For more details, please check our website or feel free to contact us.   Contact number (phone): 06-6693-3561

  • glue

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UV hybrid epoxy adhesive [EPO-TEK]

Achieving both UV positioning and high temperature and humidity resistance through thermal curing.

This is a heat-curing epoxy adhesive that can increase viscosity under UV irradiation. It allows for prevention of dripping during heating and easy positioning. It can also be used even if there are areas of the application surface that are not exposed to UV light. A standard for fiber optic bonding, 353ND, and a standard for optical component and glass bonding, 301-2, are the bases for this hybrid model, which boasts equivalent durability.

  • Company:理経
  • Price:10,000 yen-100,000 yen
  • ハイブリッド.jpg
  • glue

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Difficult-to-attach material for Structalit(r) X-1320419

Epoxy adhesive ideal for bonding polyamide (PA) and liquid crystal polymer (LCP)!

- One-component, long working time, good workability (working time guideline: 48 hours) - Curing shrinkage rate: less than 0.5% = reduced stress on the device - Can be cured at 80°C to 120°C - Good adhesion to PEEK and polyimide (PI) - We also handle adhesion of other metal components.

  • Other polymer materials

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Heat sink manufacturing / high thermal conductivity epoxy adhesive 70-3812 NC

*Heat-resistant and heat-conductive epoxy *Used for manufacturing heat sinks with excellent adhesion and low viscosity *High-performance material that passed NASA's outgassing test

This is a two-component epoxy adhesive containing aluminum, used for tools and parts that need to withstand high temperatures, or for materials requiring high thermal conductivity and heat resistance. It achieves excellent high thermal conductivity through its unique fillers, particle size, and dispersion technology. The 70-3812RNC is popular for various heat sink applications due to its good thermal conductivity. Common applications in heat sinks include bonding fins to bases, folding fin sets to bases, pin fin sets to bases, and cold plate tubes to extruded bases. It passes NASA's low outgassing test (ASTM E-595-07) and is suitable for use in outer space.

  • glue

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